Xilence Multi-Socket-Cooler M403 Pro
Produktbeschreibung:
XC029 The compact XC029 with its tower design
is the new multi-socket cooler from the Performance C Series.
Three high-performance copper heat pipes dissipate
150W waste heat to the innumerable cooling fins.
These reasons make the cooler ideal for powerful
multi-core processors.
Additionally, the heat transmission between CPU
and cooler is very evenly and efficient due to
the direct contact of heat pipes and CPU.
The mounting material make this cooler suitable
for all current AMD and INTEL sockets.
The scope of delivery not only includes the heat sink tower,
as well as the 92mm PWM fan but also a holding
module for Intel sockets 1150/1151/1155/1156/2011/2066
AMD sockets FM2+/FM1/FM2/AM2/AM2+/AM3 and a tube
of thermal paste.
For the correct installation an illustrated manual is included.
- silent hydro bearing 120mm fan - three 6mm copper
heat pipes for better heat flow - fin Design for
high airflow and efficient cooling of the CPU
and surrounding components - slight overhang of
the fan avoids hotspots - possible mounting of
the fan on both sides of the heat sink - suitable
for all current AMD and INTEL sockets
Technische Details:
Leistungen
Unterstützte Prozessorsteckplätze
LGA 1150 (Socket H3), LGA 1151 (Socket H4), LGA 1155 (Socket H2), LGA 1156 (Socket H), LGA 1200 (Socket H5), LGA 2011 (Socket R), Socket AM2, Socket AM2+, Socket AM3, Socket AM3+, Socket AM4, Socket FM1, Socket FM2, Socket FM2+
Rotationsgeschwindigkeit (min.)
500 RPM
Rotationsgeschwindigkeit (max.)
1800 RPM
Geräuschpegel (langsame Geschwindigkeit)
14,2 dB
Geräuschpegel (hohe Geschwindigkeit)
25,6 dB
Design
Grundkörper Material
Aluminium
Lamellenmaterial
Aluminium
Ventilator-Anschluss
4-polig
Leistung
Thermal Design Power (TDP)
150 W
Gewicht und Abmessungen
Abmessungen Gebläse (B x T x H)
120 x 120 x 25 mm
Durchmesser Wärmerohre
6 mm
